Packaging company Stora Enso has teamed up with NXP Semiconductors to develop new intelligent packaging using RFID technology. The development will focus on integrating RFID into packaging for consumer engagement and supply chain purposes, along with brand protection and tamper evidence applications.

Stora Enso plans to integrate NXP’s near field communication (NFC) and ultra-high frequency (UHF) into its smart packaging, allowing businesses to track their products throughout the supply chain. According to NXP, this technology will also detect if the package has been tampered with before reaching the end user. Additionally, NFC-integrated packaging will be able to provide product verification and important care and usage information to the consumer, said NXP.

“Our RFID technology in combination with Stora Enso’s packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain,” said Ruediger Stroh, EVP & GM Security & Connectivity, NXP Semiconductors.

The partnership is part of Stora Enso’s larger packaging business strategy. The company will also open a new Innovation Centre in Helsinki.

h/t: http://automationandtechnology.packaging-business-review.com/news/stora-enso-partners-with-nxp-to-develop-intelligent-packaging-290515-4588479

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