The 11th Annual Device Packaging Conference (DPC) will be held in Fountain Hills, Arizona, on March 16-19, 2015. The event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS) to showcase the latest in packaging technology.

Each year the latest in packaging technology and trends are unveiled at the DPC. The event showcases the best in packaging technology available today, as well as emerging technologies.

The event is divided into four tracks:

  • Conference and Technical Workshops (March 17-19)
  • Exhibition and Technology Showcase (March 17-18)
  • Professional Development Courses (March 16)
  • IMAPS new Global Business Council (GBC) Plenary Session on The Internet of Things (IoT) – March 18, 2015)

The GBC track includes a keynote by Bill McClean, President of market research company IC Insights, Inc., titled, “IC Market Outlook in an Unstable Economy” and, a panel discussion about “Maximizing the Internet of Everything by Mobilizing the MEMS/sensors and Adjacent Ecosystems,” facilitated by Stephen Whalley, Chief Strategy Officer of MEMS Industry Group.

For more information or to register, go to International Microelectronics Assembly and Packaging Society’s website.



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